Processor Ics
Processor Ics
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How ipad2 promote flat panel to dual-core processor
1, PoP package
PoP package, also known as stacked packages. A typical stack multiple IC chip package integrated into a single package - reduces the complexity of the motherboard and reduce the size and cost of portable devices - and the real driving force PoP method is improved by reducing the liability and Logistics and improved product flexibility.
PoP method can be used to obtain a shorter time to market, product upgrade flexibility, lower cost of a one-time engineering (NRE) and development costs, and can use the existing high-yield silicon chip, to avoid the development of new chips, Shorten the design cycle.
PoP approach to original equipment manufacturers (OEM) provides the final stage in the assembly to change the flexibility of board-level integrated solutions. For example, Acer Aspire One Battery Acer Aspire One ZG5 Battery maker plans to package digital signal processor (DSP) and the other packaged integrated high-capacity memory. However, if market conditions change, the demand to low-capacity memory chips, the OEM board-level assembly stage can be modified in the bill of materials (BOM), and does not require a new design or a new board-level routing for high-capacity storage chips can be replaced Low storage capacity chips.
If the number of IC into a single package, the need for commercial chips to order for logistics management. A typical laminated package, IC manufacturers must have ownership of all the chips inside the package. This will increase the manufacturer's financial and logistics burden. PoP IC manufacturers to eliminate the pressure of the supply chain management. This, OEM has all the ownership of integrated chips will be based on the needs of the market separately contact the appropriate supplier.
By eliminating the pressure of the supply chain, so more and more integrated device manufacturers (IDM) and circuit design companies began to use PoP technology. It also facilitates the development of such packages, and is expected to replace in the next few years, the typical 2-layer chip stack package and gradually replace the high end (> 3-chip) stack package.
2, low-power design
In the deep sub-micron process, the sub-threshold leakage current with the decrease of threshold voltage rose. Some studies suggest that less than 90nm process, the static power consumption in the proportion of the total power consumption in more than 50% and rising exponentially. Therefore, reducing static power into an advanced low-power CMOS circuit design of the main objectives. General with the dynamic power supply voltage proportional to the voltage in different regions by using different voltage can effectively control the dynamic power consumption. Static power is accompanied by the semiconductor manufacturing process into deep sub-micron generated when a new topic, for many chip suppliers are headaches. Apple's 2008 acquisition of P.A.SEMI leader in this field but it is. Their low-power design, with many core technologies.
P. A. SEMI's founder and CEO，He has worked at DEC, Broadcom, from entry in 1976 began to engage in processor design, has led a variety of processor designs, which have Dingding name of strongARM and MIPS. And most of his followers joined the PASEMI engineer also from Intel, AMD and other processor giant, have been involved in most of the Itanium and Xeon processor-design work. The reason why Apple took a fancy to buy PASEMI processor design in the field of intellectual resources.
Now certainly, PA Semi chips certainly involved in the design of Apple, they should be in the dynamic power and static power management has made the greatest contribution.
PA Semi PWRficient show in 2005, the chip through the power-gating, and clock gating to achieve a miraculous energy efficiency. Power gating is a relatively straightforward technique that can turn off some of the chip is not running. But this is difficult to achieve than it sounds, because you have to chip into different blocks in order to sleep or wake up alone. You also have to adjust the block size and layout to ensure access to termination of sleep caused by the delay will not affect the rhythm of the entire chip.
Clock gating is another technique used by PWRficient large, equally difficult to achieve. Dynamic power clock distribution network may reach up to half of the entire SoC power consumption. Gated clock tree optimization technology is a way to turn off when not needed as part of the chip clock source to save power.
Apple's processor is using the specific circumstances of these two technologies is not clear, unless Apple themselves released. But even if not currently used, these technologies are already in Apple's processor plays a very important role.
3, IP core
There are also rumors that Apple iPad2 processor used in the A5 and actually an enhanced A4 processor. But in any case be sure, they must have adopted the ARM's Cortex-A series of cores, the difference is, Cortex-A9 A8 compared to the main DSP enhanced performance and added some control unit executes faster than A8.
A5 graphics core aspects of the SGX series follows the HP Pavilion DV7 Battery Power VR core, this section has been more than Apple, a kernel for your processor. Including TI, Samsung and other semiconductor manufacturers will use it for their own processor. Thus, its performance is certainly worth the wait. But whether the processor and NVIDIA graphics core of a high, we should wait until after the release of the related products. Note: This apple is not food.
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Will I be able to upgrade my compaq presario V2030US motherboard?
I am using a V2030us presario and its motherboard failed recently. I have the technical specifications. The part # for the motherboard is 373522-001. I have been searching for a cheaper deal but the motherboard looks very expensive.
below are the specifications of the motherboard.
Specifications: Motherboard with Centrino technology (Full-Featured) - For Intel 855GM c hipset with 400MHz processor side bus and integrated Intel Extreme Graph ics 2, up to 64MB video memory
Will I be able to upgrade the motherboard so that I can fix my laptop motherboard for a cheaper price?
That doesn't sound like worth the price to fix unfortunately...
The cost of the motherboard, plus any labor (unless you do it yourself) is going to be in the round-about range of $250-300... and you can find a decent laptop for $499-649
Laptop Overclocking